Laser manufacturing technology is to the high energy of the laser and the physical interaction between the material, the material gasification, ablation, modification and so on to achieve the effect of material processing. Nowadays, laser processing is rapidly entering into various industries, and at present, metal material processing is still the main focus, occupying more than 80% of the entire laser processing applications. Due to iron, copper, aluminum and corresponding alloys and other metals for hard materials, and the role of the laser effect is better, so it is easy to apply laser processing. For some common metal laser cutting, welding applications, may only need to understand the corresponding optical power can be, the processing of the research requirements will not be very strict.

But in fact, life and high-end manufacturing field uses a very large number of non-metallic materials, such as soft materials, thermoplastic materials, thermal materials, ceramic materials, semiconductor materials and glass and other brittle materials. If these materials are to be processed by laser, the requirements for beam properties, ablation and material breakage control are very stringent, and are often required to achieve ultra-fine processing, even at the micro-nanometer level. The use of common infrared laser is often difficult to achieve the effect, the ultraviolet laser is a very suitable choice.

UV laser technology is used for a variety of purposes

Ultraviolet laser refers to the output beam is located in the ultraviolet spectrum, light invisible to the naked eye, the current common industrial UV lasers are solid crystal UV lasers as well as gas UV lasers two. Infrared all-solid-state lasers can be tripled to obtain ultraviolet laser output, the wavelength is more 355nm, the pulse width has been successfully developed from nanoseconds to picoseconds. Gas ultraviolet laser is commonly excimer laser, can be used for ophthalmic surgery, chip photolithography. In recent years, fiber lasers have also gradually developed ultraviolet wavelength products, the most representative of the picosecond ultraviolet fiber laser. Due to the ultraviolet laser in the frequency conversion heat loss, the cost is still high, at present to do higher power is still a certain degree of difficulty. Ultraviolet laser is often considered a cold light source, so the ultraviolet laser processing is also known as cold processing, very suitable for the processing of brittle materials.

UV laser processing of common brittle materials

Glass is a material used in large quantities in life, from water cups, wine glasses, containers to glass jewelry, the production of patterns on the glass is often a difficult problem, and traditional processing often results in a high rate of damage to the glass, the UV laser is very suitable for marking the surface of the glass, pattern production, and can achieve ultra-fine production. Ultraviolet laser marking to make up for the past processing accuracy is not high, difficult to chart, damage to the workpiece, pollution of the environment and other shortcomings, with its unique processing advantages to become the new favorite of glass products processing, by the various liquor cups, crafts and gifts industry included in the necessary processing tools.

Ceramic materials are used in a large number of buildings, utensils, decorations, etc., but in fact, ceramics also have many applications in electronic devices, such as the previous cell phone business launched a ceramic back cover, in the field of mobile communications, optical communications, electronic products are widely used in the ceramic core, ceramic substrate, ceramic encapsulated base, fingerprint identification system of ceramic cover and so on. The production of these ceramic components is becoming more and more delicate, and the use of UV laser cutting is now a more ideal choice. Ultraviolet laser for some ceramic sheet processing precision is very high, will not cause ceramic cracks, and a molding without the need for secondary grinding, the future will be more applications.

Ultraviolet laser wafer cutting: sapphire substrate surface hard, general knife wheel is difficult to cut it, and abrasion, low yield, cutting channel is greater than 30 μm, not only reduces the use of the area, but also reduces the production of products. Driven by the blue and white LED industry, the demand for sapphire substrate wafer cutting has increased greatly, and higher requirements have been put forward to improve productivity and qualified rate of finished products. UV laser cutting wafers can realize high-precision cutting, smooth kerf, and greatly improved yield rate.

Quartz cutting has always been a problem in the industry, the most commonly used in the traditional processing methods is "diamond stone saw blade", that is, through the "hard" approach to processing. Quartz is very brittle, processing difficulty is very high, the diamond stone saw blade is a consumable.

Ultraviolet laser has ± 0.02mm of ultra-high precision, can completely guarantee the precise cutting needs. In the face of quartz cutting, precise control of power can make the cut surface very smooth, and the speed is much faster than manual processing. Parameters can be displayed through the full digital display, through the computer to accurately adjust the different parameters, accurate and more intuitive, the difficulty of getting started is much lower than manual cutting.

Source: OFweek Laser